Silikɔni ɛponji ye fɛn ye min bɛ ɲɔgɔn sɔrɔ min bɛ silikoni ka funteni hakɛ caya-sponge ka wuliliko fara ɲɔgɔn kan, wa a bɛ kɛ ka caya dasirili, sɔgɔli, funteni-sɛnɛ ani foro wɛrɛw la.
一,o ye a ka paramɛtɛrɛw jɔnjɔnw ye ani a nafa danma ye:
1.Density - Yɔrɔ: 0,15 fo 0,8 g/cm Ni density (dansi) bɛ Dɔgɔya, a ka nɔgɔn ani a ka nɔgɔn, o min bɛnnen don buffering (tampon) ma. Densité (dansi) min ka bon, o kɔrɔ ye ko dɛmɛ barikama don.
2. Gɛlɛya - Sumanikɛlan: Kɔgɔjida la gɛlɛya (Kɔgɔda A) - Nafa danma: 10 fo 50 ha. Misali la, HA 20 bɛ kɛ ka siginiden nɔgɔman kɛ ani ka ha 40 kɛ ka ɲɛsin jɔli ma.
3. Resilience - rebound rate: ka tɛmɛ walima ka bɛn 70% ma (a kɔrɔbɔra iko ISO 8307). Ni nafa ka bon, sɛgɛn kunbɛncogo ka fisa.
4. Funteni kunbɛncogo - Baarakɛ funteni: -50 degɛrɛ la ka se degere 250 ma (a ka ɲi ka baara kɛ ni waati jan ye, o ka kan ka dɔgɔya walima ka bɛn degere 200 ma )
2,Aplication scenarios ani sugandili sariyaw:
Ka kɛɲɛ ni wajibiyalenw ye, paramɛtɛrɛw ka kan ka ladilan kɛrɛnkɛrɛnnenya la:
1. Sealing gasket - Paramɛtiriw minnu bɛ fɔ: Density 0.4g /cm
2. shock-Baarakɛminɛnw - Paramɛtiriw ladililenw: density 0.25g /cm3, resilience ka bon ni walima ka bɛn 80% ma, i n’a fɔ mobili sigilan falen.
3. High-Semperature Insulation - Aw bɛ modɛli dɔ sugandi min ka funteni hakɛ bɛ se ka caya walima min bɛ bɛn degere 200 ma ani ka tasumafagalanw fara a kan (UL94 V0 seereyaw).